Intaglio printing plate electroplating process - nickel plating process maintenance
Release Time:
Jun 16,2017
The standardized management of electroplating processes for roller plating is a method for processing gravure substrates and an important means to extend the service life of gravure. However, due to the special relationship between electroplating theory and practice, each plate-making company relies on its own experience. When problems arise, they tend to treat symptoms rather than the root cause, leading to a variety of control methods without forming a scientifically sound and guiding process specification. This results in numerous issues during production, causing many rollers to require rework.
This article is a summary made while helping some plate-making companies implement standardized management of electroplating processes, attempting to explore a set of practical control methods to effectively and stably improve electroplating quality.
1. Maintenance of Nickel Plating Process
(1) Ensure precise solution ratios and make appropriate adjustments based on different equipment. If the effective component content of the solution is low, the current will be too low. Therefore, daily checks of pH and Be° values are necessary, supplementing what is lacking. Records should be kept during shift changes, the liquid level must be sufficient, and the pH must meet the standard (not less than 3.8). Nickel plating solution should be tested twice a week.
(2) A filtration pump should be added to the nickel tank to filter the nickel solution, ensuring it is clean.
(3) Some companies have a higher ratio of components like nickel sulfate, which can cause the plating layer to blister if the new solution is too concentrated. Therefore, the solution should be slightly diluted. After nickel plating, it should be polished with 1000# fine sandpaper, and fingerprints must not be allowed.
(4) After nickel plating, it must be rinsed thoroughly with pure water. If rinsed with tap water, poor water quality can affect the adhesion between nickel and copper.
(5) Copper and iron are the biggest hazards to nickel plating; therefore, copper solution must never enter the nickel plating tank during lifting.
(6) After nickel plating, it is prohibited to leave the items for a long time (not exceeding 40 minutes); they should be kept moist to prevent nickel from passivating in the air.
(7) If many pinholes are found in the nickel layer, a pinhole prevention agent can be used with hydrogen peroxide. Dilute 30% hydrogen peroxide to 1-3ml/L and slowly pour it into the plating solution while stirring continuously to remove impurities. The plating solution should then be filtered.
2. Quality Standards for Nickel Plating Layer
(1) The thickness of the nickel layer on one side should be 8-10μm.
(2) The nickel layer should be a slightly yellow, fully covered plating layer, with no burrs or other defects.

Leave Messags.
Any inquiries? questions? We’re here to help. Send us a message and we’ll be in touch.