Intaglio printing plate electroplating process - Copper plating: Copper plating process flow, roller copper plating principle!


Release Time:

Jun 24,2017

Copper must cover the defects of the steel roller and provide the best working surface for the next process - electric engraving. Copper plating is an extremely complex process that requires very strict control; any carelessness can lead to a significant amount of time, labor, and material being spent to correct the problems that arise.

Copper Plating Process  Metalworking Roller → Inspection → Distribution of Rollers → Roller Pretreatment → Nickel Preplating → Polishing and Cleaning → Copper Plating → Unloading Roller → Delivery Grinding

Principle of Roller Copper Plating

The copper plating layer is pink, soft, and has good ductility. The main components of the electrolyte solution in the copper plating tank are sulfuric acid (H₂SO₄) and copper sulfate (CuSO₄·5H₂O). Copper exists in this solution in the form of copper ions (Cu²⁺). Phosphor copper is used as the anode, distributed in a semicircular arc in the electrolyte solution, and connected to the power supply anode. The roller is placed horizontally in the electrolytic tank, with some parts fully immersed in the electrolyte solution, while others are partially or one-third immersed, connecting with the cathode and rotating at a certain speed. After power is applied, a chemical reaction occurs between the anode and cathode; the positively charged copper ions are attracted to the cathode, gaining electrons to form copper atoms that adhere to the roller, completing the electroplating. However, due to certain reasons, this reaction process can be interfered with, and the positive and negative ions will never balance, making it difficult to produce satisfactory electroplated rollers in actual production. In response to this situation, we can only strive to reduce interference factors and match various equipment and processes according to the company's conditions to produce satisfactory electroplated rollers.  Strengthening Conductivity Management

To improve the quality of the copper layer, it is important to control the current difference, ensure that the conductive parts are clean and in good contact, and distribute the current value evenly, so that the hardness of the copper layer at both ends and in the middle of the roller is consistent.Recommended Good Products ↘Japanese original imported acidic fast electroplating hard copper process, copper plating additives4)和硫酸铜(CuSO4·5HRecommended Good Products ↘O)。铜在这种溶液中以铜离子(Cu2+)形式存在。以磷铜作为阳极,按半圆弧分布于电解溶液中,并与电源阳极相接。滚筒横放在电解槽中,其表面有的是全部浸入电解溶液中,有的是半浸或1/3浸入电解溶液中,它与阴极相接,并以一定转速旋转。通电后,阴阳两极发生化学反应,铜离子带有正电荷,被阴极吸引,在阴极获得电子而形成铜原子,并附着在滚筒上,完成电镀。但事实上,由于某些原因会干扰这种反应过程,正负离子始终不会平衡,所以在实际生产中不容易制得很满意的电镀滚筒。针对这种情况,只能尽力做到减少干扰因素,根据本公司的条件,进行各种器材、工艺的匹配,以制得满意的电镀滚筒。

3.  加强导电性管理

提高铜层质量,重要的是控制好电流差,保证导电部位干净和接触良好,使电流值分布均匀,使滚筒两端和中间的铜层硬度一致。

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