Intaglio printing plate electroplating process - copper plating: process maintenance, power supply, precautions!
Release Time:
Aug 03,2017
Offset printing plate electroplating process - Copper plating: process maintenance, power supply, precautions!
Copper plating process maintenance
(1) Anode frame sleeveAnodeBags can prevent sand holes, and the anode bag should be replaced in a timely manner when it gets dirty.
(2) Regularly replace the filter element of the copper plating solution to ensure the solution is clean.
(3) Frequently check the liquid level of the plating solution; if insufficient, add softened water to the specified level. The copper plating solution should be tested every two days.
(4) The copper plating solution should be stirred thoroughly.
(5) Regularly clean the impurities at the bottom of the tank, generally once every three months, while impurities in the upper tank must be cleaned once a week.
(6) Check the temperature of the plating solution daily; it is best to hang a thermometer in the tank to strictly control the temperature.
(7) Strictly control the specific gravity.
(8) Check dailycopper plating additives, keep the additive dosage stable.
(9) It is best to cover the plating tank to reduce air pollution.
(10) Add copper balls daily; the copper balls should be soaked in dilute sulfuric acid first and rinsed clean every day. The black copper powder and other oxides on the surface of the copper balls should be washed off, or rinsed with 1:15 diluted oxidizing water.
Power supply
(1) Calculate current: immersed area × 18A/dm2= total current.
(2) Copper plating time (ampere-hours): Ah = area × thickness / K. Here, K is a theoretical constant that must be tested; some companies specify K = 1.3, with area in square decimeters and thickness in microns. The thickness of the copper layer ranges from 90 to 200 microns. If the thickness is too small, the K value should also be adjusted, as ampere-hours are constant.
(3) Power supply method
(a) Gradually increase the current from small to large, supplying 1/3 in one minute, reaching the specified value in three minutes.
(b) Apply a small current of 100-200A for 50Ah, then slowly raise the current to the calculated value.
(4) Precautions
(a) During the copper plating process, frequently observe the stability of current, temperature, and voltage.
(b) Under good conductivity of the equipment, the tank pressure should be less than 12V. A high voltage indicates insufficient sulfuric acid and poor conductivity.
Leave Messags.
Any inquiries? questions? We’re here to help. Send us a message and we’ll be in touch.