Copper layer micro-etching agent

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Metal cleaner

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Description

Copper layer micro-etching agent

The micro-etching agent is formulated with an advanced formula, which has a good effect on removing corrosion on the surface of copper and copper alloys and improving the surface roughness of the workpiece. The corrosion speed is fast and controllable. It is widely used in the production of PCB circuit boards and the cleaning of gravure laser plate rollers. , Electroplating copper foil surface atomization, acid copper plating surface matt treatment, continuous electroplating of fog copper, instead of sandblasting surface roughening and other processes.

Effect comparison:

Product advantages:

The micro-etching speed is stable and controllable;

The composition is stable in nature, does not decompose, and has a long service life;

The method of configuring the solution is simple and convenient to use;

Within the process range, the accumulation of copper ions has almost no effect on the etching speed;

Compared with imported products, the cost performance is high, and the use and maintenance costs are low;

Convenient analysis and control;

Does not contain difficult-to-decompose substances, easy to treat wastewater;

No volatile gas will be generated during use, and no adverse effect on the operating environment.

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Metal cleaner for gravure copper layer